ALL-BOND 2

Universal dual-curing adhesive system

Designed for use in all bonding procedures.

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Dual polymerization

Self-curing and photo-curing adhesive.

Compatibility

Compatible with all light-curing, self-curing, and dual-curing materials.

Total etching

Can be used with total etching techniques.

Single membership

Legendary market standard for its ability to adhere to multiple substrates.

Hydrophilic

Contains the hydrophilic monomer BPDM, patented by Bisco, which guarantees high adhesion values.

Awards

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