Universal light-curing adhesive
All-Bond Universal is the result of over 30 years of Bisco research on adhesives.
All-Bond Universal is compatible with all dual-curing, light-curing, and self-curing composite materials and resin cements. It is ideal for all direct and indirect adhesive procedures.
Offers maximum flexibility for use in total etching, self-etching, or selective etching modes.
High adhesion to all substrates.
Other adhesives may require more than one product for indirect restorations, but with All-Bond Universal activator is needed.
Contains MDP monomer, which significantly improves seal durability and adhesion to indirect restorations.
Film reduced by 10µm.
With all composite materials and light-curing, self-curing, and dual-curing cements for all direct and indirect procedures.
